Sunday, December 9, 2012

Advancements Through Surface Mount Assembly Construction

By Gloria Day


The people are always demanding faster electronics with better processing and slimmer designs. Technology has been able to keep up with the insisting masses thanks in no small part to a more innovative way of manufacturing the circuitry that goes inside these devices. Surface mount assembly has made it possible to create components that will run these items in a more dependable way while holding costs down through effective construction costs.

This innovative mounting technology is a process used when constructing electronic circuits that eliminates the previously necessary step of drilling holes into the device. With this style of manufacturing, all pins and leads are no longer inserted through the board, rather they are soldered to its surface. The quick and less expensive production is just one of many benefits from switching to this method.

There was a time when creating a circuit board meant drilling holes in the device in which the pins and wires were to be inserted and then secured by soldering to the underside. This method took a lot more time and had a few other issues that tended to slow down productivity. One of the biggest efficiency issues was that very often the parts would not fit together properly and time had to be spent correcting that problem.

Finding a way to simply connect all the leads onto the surface of the printed circuit board made drilling holes and bulky soldering on the underside of the device completely unnecessary. Without those features, the chips could be smaller and more efficient because everything fit together much more smoothly. A compacted size gave designers the freedom to create a system that could fit more technology into a smaller space without compromising the processing time.

Prior to the 1980's, electronic components were produced using a much bulkier design that had lots of wires arching from one pin to another. Once this more compact method was introduced, its benefits were immediately recognized and it became the primary way of manufacturing circuit boards because it lacked most of the inconveniences previously experienced. Topside soldering is faster because it eliminates drilling and the overall production is less expensive.

The surface mounting technique is the primary method by which the majority of massed produced electronic hardware is created at this time. Because of all the advantages, it did not take long for the old way to become near obsolete. It is now possible to produce slim design products that have increased functionality at affordable prices which translate into lower costs for both consumers and manufacturers.

There are several different categories under which these components are available to perform a number of various functions for multiple types of electronics. These include, but are not limited to transistors and diodes, integrated circuits and resistors and capacitors which are considered to be passive surface mount devices. There are slight variances in the construction of each style that makes their productivity work.

Surface mount assembly technology has made undeniable contributions in the industry of manufacturing circuit boards for electronics. The simple, yet high impact change in design has made it possible to produce these components quicker and less expensively. With just a few variations on the technique, there are so many ways these parts can be used to run even more innovative products.




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